【Dongxing Securities: The Electronics Industry is Entering a New Development Stage, Optimistic About HBM Direction】Jin Ten Data, December 18 - Dongxing Securities' research report points out that the current hardware innovation cycle combined with the AI wave has led the electronics industry into a new development stage. The rise of large AI models has created a massive demand for computing power, while the significant increase in data processing volume and transmission speed has raised the requirements for chip memory capacity and transmission bandwidth in AI servers. HBM, as a high-performance DRAM based on 3D stacking technology, breaks the bottlenecks of memory bandwidth and power consumption. TrendForce estimates that by 2025, HBM will contribute 10% of the total DRAM output, doubling from 2024. Due to the high average unit price of HBM, its contribution to the total output value of the DRAM industry is expected to exceed 30%. It is projected that by 2029, the HBM market size will grow to 7.95 billion USD. (Securities Times) (Transferred from: Jin Ten Data)