According to official sources, the Hong Kong Monetary Authority has announced the launch of the "Digital Bond Funding Scheme", which originates from the 2024 Policy Address and aims to promote the development of the digital securities market and encourage the wider use of tokenization technology in the capital market. The program is open for applications from today onwards, with a duration of three years. Eligible digital bond issuances in Hong Kong can receive up to HKD 2.5 million in funding.

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