The Hong Kong Monetary Authority (HKMA) today (28 November) launched the Digital Bond Funding Scheme (the Funding Scheme), which was announced in the 2024 Policy Address. The Funding Scheme aims to promote the development of the digital securities market and encourage wider use of tokenization technology in the capital markets. Each digital bond issued in Hong Kong will be eligible for a grant of up to HK$2.5 million if the relevant eligibility requirements of the Funding Scheme are met. After consulting the industry, the HKMA has set out the details of the Funding Scheme in the Digital Bond Funding Scheme Guidelines (English version only). The Funding Scheme is open for application from today for an initial period of 3 years.