According to BlockBeats, on November 29, the Hong Kong Monetary Authority (HKMA) today (November 28) launched the "Digital Bond Funding Scheme" (funding scheme) announced in the 2024 (Policy Address).
The funding scheme aims to promote the development of the digital securities market and encourage the wider use of tokenization technology in the capital market. If the relevant eligibility requirements of the funding scheme are met, each digital bond issued in Hong Kong can receive a subsidy of up to HK$2.5 million.
After consulting the industry, the HKMA has set out the details of the funding scheme in the "Digital Bond Subsidy Scheme" Guide (English version only). Applications for the funding scheme will start from today and will initially last for 3 years.
