According to TechFlow, on November 28, the Hong Kong Monetary Authority announced the launch of the "Digital Bond Funding Scheme", which is derived from the 2024 Policy Address and aims to promote the development of the digital securities market and encourage the wider use of tokenization technology in the capital market. The scheme is open for applications for a period of three years, and eligible digital bond issuances in Hong Kong can receive a maximum of HK$2.5 million in funding.