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Hong Kong Monetary Authority launches digital bond funding scheme with maximum funding of HK$2.5 million
According to Odaily Planet Daily, the Hong Kong Monetary Authority launched the "Digital Bond Funding Scheme" today, aiming to promote the development of the digital securities market and encourage the capital market to use tokenization technology more widely.
Eligible digital bonds issued in Hong Kong can receive a subsidy of up to HK$2.5 million. The subsidy scheme is now open for application and will initially last for three years. The HKMA has detailed the details of the subsidy scheme in the guidelines.
Eligible digital bonds issued in Hong Kong can receive a subsidy of up to HK$2.5 million. The subsidy scheme is now open for application and will initially last for three years. The HKMA has detailed the details of the subsidy scheme in the guidelines.
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